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SG Talk > SG Talk > Market Talk > $338 Million: Toppan to Build First-Ever Chip Package Substrate Plant in Singapore
Full Version: $338 Million: Toppan to Build First-Ever Chip Package Substrate Plant in Singapore
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Kumarp

16-03-2024, 09:55 AM
By 2028, the market for chip substrates is expected to surge to $29 billion, nearly doubling from its 2022 valuation of $15 billion.


[Image: Singapore-Flag.webp]

https://techovedas.com/338-million-toppa...singapore/

Rubitin

16-03-2024, 10:23 AM
(16-03-2024, 09:55 AM)Kumarp Wrote: [ -> ]By 2028, the market for chip substrates is expected to surge to $29 billion, nearly doubling from its 2022 valuation of $15 billion.


[Image: Singapore-Flag.webp]

https://techovedas.com/338-million-toppa...singapore/
More High-end High value good paying job.

Sticw

16-03-2024, 03:37 PM
Sophisticated sounding plastic tray to house the expensive chips... Not really high tech chips but still high value cos it is used in the chips...
SG Talk > SG Talk > Market Talk > $338 Million: Toppan to Build First-Ever Chip Package Substrate Plant in Singapore