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Kumarp

03-06-2024, 10:20 AM
The Malaysia P1 plant will feature advanced packaging and testing technologies, including wafer bumping, wafer-level chip packaging, and flip chip packaging.

https://techovedas.com/rm-6-billion-inve...in-penang/

Tangsen

03-06-2024, 10:23 AM
Good luck … hardware is easy "software" is hard
SG Talk > SG Talk > Market Talk > RM 6 Billion Investment: SPIL New Factory to Create Nearly 3,000 Jobs in Penang