SG Talk

The patent outlines a method of using SAQP to “increase the design freedom of circuit patterns”, which is similar to a patent granted in December to SiCarrier, a state-backed chip tool developer related to Huawei. SiCarier’s patent describes a way of producing chips on a 5-nm process node using deep ultraviolet lithography (DUV) tools, the Post reported in April. DUV is less advanced than EUV, but China has been stockpiling equipment since last year to deal with more stringent export restrictions.

https://www.scmp.com/tech/big-tech/artic...h-existing

Likely they are doing it with a lower yield more costly process.

In the end SMIC has very thin margins.

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(06-06-2024, 05:03 PM)sgbuffett Wrote: [ -> ]The patent outlines a method of using SAQP to “increase the design freedom of circuit patterns”, which is similar to a patent granted in December to SiCarrier, a state-backed chip tool developer related to Huawei. SiCarier’s patent describes a way of producing chips on a 5-nm process node using deep ultraviolet lithography (DUV) tools, the Post reported in April. DUV is less advanced than EUV, but China has been stockpiling equipment since last year to deal with more stringent export restrictions.

https://www.scmp.com/tech/big-tech/artic...h-existing

Can u change your thread title? I thought pork chop leh.