China Makes World’s Most Advanced 3D NAND memory chip Despite US Sanctions - Printable Version

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China Makes World’s Most Advanced 3D NAND memory chip Despite US Sanctions - Kumarp - 28-10-2023

TechInsights recently made an unexpected technological leap by uncovering a groundbreaking 232-layer Quad-Level Cell (QLC) 3D NAND memory chip within a consumer device, marking World’s most advanced memory achievement from China

This discovery has far-reaching implications for the realm of high-performance computing (HPC), particularly in applications such as artificial intelligence (AI) and machine learning. 

https://techovedas.com/china-makes-worlds-most-advanced-3d-nand-memory-chip-despite-us-sanctions/




China’s Yangtze Memory Technologies Co., Ltd. (YMTC) has created a chip that represents a significant stride forward in memory chip design and is poised to reshape the landscape of advanced memory technology.

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