SK Hynix Plans to Produce 3D NAND at -70°C : Could Achieve Upto 400 Layers -
Kumarp - 07-05-2024
Traditionally, etching vertical holes in semiconductor structures has been a major challenge due to limitations in existing etching equipment. SK Hynix’s adoption of TEL’s new low-temperature etching tools opens up exciting possibilities by allowing for deeper memory channel holes with excellent uniformity.
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https://techovedas.com/sk-hynix-plans-to-produce-3d-nand-at-70c-could-achieve-upto-400-layers/