07-05-2024, 11:10 PM
Traditionally, etching vertical holes in semiconductor structures has been a major challenge due to limitations in existing etching equipment. SK Hynix’s adoption of TEL’s new low-temperature etching tools opens up exciting possibilities by allowing for deeper memory channel holes with excellent uniformity.
Read More here💡
https://techovedas.com/sk-hynix-plans-to...00-layers/
Read More here💡
https://techovedas.com/sk-hynix-plans-to...00-layers/
![[Image: b8aec5cd64a2931ebb14f2412a6b8dad-high-Res.jpg]](https://i.ibb.co/tHC3sv3/b8aec5cd64a2931ebb14f2412a6b8dad-high-Res.jpg)